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IPC Releases New Standards Revisions
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.

For printed boards, IPC-2223E will provide designers of flexible/rigid-flexible designs with updated figures, new sections and comments on microvia stacking, back drilled holes and dual row zero insertion force (ZIF) connectors.

IPC-6102E provides new acceptance criteria for back drilled holes, discussion on reliability issues for microvia structures in Class 3 products, and establishes new requirements for copper wrap plating of holes in new designs.

For those involved with wire harness requirements and acceptance IPC/WHMA-A-620D provides some new acceptability criteria, figures and graphics on target conditions, solderless wrap section revisions, and a new section  added on over-molding of flexible flat ribbon.

The connected factory exchange (CFX) standard, IPC-2591 V1.1 provides changes made to message sections and message structure sections. Appendix A was added with a short description of all changes from V1.0 and Appendix B provides acronyms and abbreviations.

IPC-1791A provides a new Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations. Several sections have been updated and added to 1 scope and 3.0 requirements.

IPC would like to thank the many committee members for their participation in developing standards for the electronics industry to help build electronics better.

For more information or to purchase these new releases, visit
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